δΈ­ζ–‡η‰ˆ ENGLISH  
 
  Products
- Recommendation of EMCMaterials for Discrete
  For Diode & Bridge
  For Transistor
- For SMA Type Package
  For Full Pack Type Package
- Recommendation EMC Materials for IC
- Recommendation EMC Materials for SMD
- Green Molding Compound
 
 
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Add: Songtiao Hi-Tech Indestry Development Zone,
Lianyungang,Jiangsu Province,China
Tel: 86-518-85153822
Fax: 86-518-85153801
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Products Shows
Recommendation EMC Materials for IC(ZIP/SIP/DIP/SDIP)
  Main Composition
 
  KL-1000-4TX KL-1000-3A KL-1000-20 KL-2500-1/1K KL-4500-1/1N KL-6500H
Epoxy OCN OCN OCN OCN+DCPD OCN+DCPD OCN+DCPD
Hardener PN PN PN PN PN+Xylok PN+Xylok
Filler Content WT% 7376 7376 7376 7376 7478 7882
Fill Type Crystal Crystal+Fused Crystal+Fused Crystal+Fused Fused+Crystal Fused+Crystal
Additive   Strees-Releasing Agent   Strees-Releasing Agent Strees-Releasing Agent Strees-Releasing Agent
Package Application ZIP/DIP ZIP/DIP ZIP/DIP ZIP/DIP/SDIP ZIP/DIP/SDIP ZIP/DIP/SDIP
  Main Technical Paramter
 
Item Unit KL-1000-4TX KL-1000-3A KL-1000-20 KL-2500-1 KL-2500-1K KL-4500-1K
KL-4500-1N		 KL-6500H
Spiral Flow cm 78 80 76 82 94 86 105
Gel Time s 23 20 21 24 22 21 28
CTE-1 1/(ppm) 26 25 21 21 20 16 12.5
CTE-2 1/(ppm) 72 70 68 68 67 62 58
Tg ℃ 160 160 160 150 145 145 135
Flexural
Strength		 Kdf/mm2 14 14 14 13 13 13 13
Flexural
Modulus		 Kdf/mm2 1450 1500 1450 1500 1550 1500 1650
  For ZIP/DIP Package
 
  Package Application of Huawei's Products
 
Package Requirement Recommendation
ZIP,SIP,DIP,SDIP(16PIN) Low Cost
Moldability		 KL-1000-4T/4TX/3A
ZIP,SIP,DIP,SDIP(32PIN) Low Cost
Low Strees 		KL-1000-20
KL-2500-1/1K
ZIP,SIP,DIP,SDIP(32PIN) Low
Moldability
Thermal shock
Resistance		 KL-4000-1T
KL-4500-1/1N
KL-6500H
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