Henkel Huawei Electronics Co.,Ltd

Products

- Recommendation of EMCMaterials for Discrete

	For Diode & Bridge
	For Transistor

- For SMA Type Package

For Full Pack Type Package

- Recommendation EMC Materials for IC

- Recommendation EMC Materials for SMD

- Green Molding Compound

Add:	Songtiao Hi-Tech Indestry Development Zone, Lianyungang,Jiangsu Province,China
Tel:	86-518-85153822
Fax:	86-518-85153801
P.C:	222006

Products Shows

For SMA Type Package(SOT-23/SOT-89/D-PAG/D2-PGA)

For Full Pack Type Package
(TO-126F/TO-220F/TO-3PF)

Main Composition

	KL-5000-1	KL-5000-2	KL-5000-2B	KL-500-HT
Epoxy	OCN	OCN	OCN	OCN+DCPD
Hardener	PN	PN	PN	PN
Filler Content WT%	7880	7882	8084	8285
Fill Type	Crystal	Crystal+Fused	Crystal+Fused	Crystal+Fused
Additive		Strees-Releasing Agent	Strees-Releasing Agent	Strees-Releasing Agent
Thermal Conductivity(w/m.℃)	1.6	1.8	1.9	2.2
Package Application	TO-220F,126F	TO-220F,126F,3PF	TO-220F,3PF	TO-220F,3PF

Main Technical Paramter

Item	Unit	KL-5000-1	KL-5000-2	KL-5000-2B	KL-5000HT
Spiral Flow	cm	6090	5095	5080	5085
Gel Time	s	2038	2238	2538	2440
CTE-1	1/(ppm)	25	23	22	22
CTE-2	1/(ppm)	70	68	60	60
Tg	℃	160	155	155	155
Flexural Strength	Kdf/mm²	14	15	15	14
Flexural Modulus	Kdf/mm²	1800	1900	2000	2000
Thermal Conductivity	W/M.℃	1.6	1.8	1.9	2.1

Summary for For Full Pack Type Package of Huawei's Products

Charateristics
High thermal conducticity range from 40 to 60 Cal/cm.sec.℃
Low strees
High adhesive strength
Low water absorption
Moldability and workability is much bbrtter
Reduced mold friction by using special type filler
High filler contents range from 78 to 84 wt%