Henkel Huawei Electronics Co.,Ltd

Products

- Recommendation of EMCMaterials for Discrete

	For Diode & Bridge
	For Transistor

- For SMA Type Package

For Full Pack Type Package

- Recommendation EMC Materials for IC

- Recommendation EMC Materials for SMD

- Green Molding Compound

Add:	Songtiao Hi-Tech Indestry Development Zone, Lianyungang,Jiangsu Province,China
Tel:	86-518-85153822
Fax:	86-518-85153801
P.C:	222006

Products Shows

For SMA Type Package(SOT-23/SOT-89/D-PAG/D2-PGA)

Main Composition

	KL-4000-1S	KL-4500-1S	KL-6500S	KL-6800S	KL-6500H	KL-7000H	KL-8000H
Epoxy	OCN	OCN	OCN	OCN+DCPD	OCN+DCPD	OCN+DCPD	Biph
Hardener	PN	PN	PN	PN+Xylok	PN+Xylok	Multi	Multi
Filler Content WT%	74～76	76～79	78～80	78～82	78～80	80～84	83～86
Fill Type	Fused	Spherical+ Fused	Spherical+ Fused	Spherical+ Fused	Spherical+ Fused	Spherical	Spherical
Additive	Strees-Releasing Agent	Strees-Releasing Agent	Strees-Releasing Agent	Strees-Releasing Agent	Strees-Releasing Agent	Strees-Releasing Agent	Strees-Releasing Agent
Package Application	SOT-23,89 D-PAG /D2-PAG	SOT-23,89 D-PAG /D2-PAG	SOT-23,89 D-PAG /D2-PAG	SOT-23,89 D-PAG /D2-PAG	SOT-23,89 D-PAG /D2-PAG	D-PAG /D2-PAG	D-PAG /D2-PAG

Main Technical Paramter

Item	Unit	KL-4000-1S	KL-4500-1S	KL-6500S	KL-6800S	KL-6500H	KL-7000H	KL-8000H
Spiral Flow	cm	86	98	110	124	105	109	110
Gel Time	s	24	22	26	30	28	24	26
CTE-1	1/℃(ppm)	16	14	14	13	12.5	12	10
CTE-2	1/℃(ppm)	60	58	58	58	58	56	48
Tg	℃	145	140	140	135	130	125	120
Flexural Strength	Kdf/mm²	14	14	14	13	13	13	14
Flexural Modulus	Kdf/mm²	1440	1450	1600	1600	1700	1750	2150

For SMD PKG

Summary for SOT Package of Huawei's Products

Charateristics
Decreasd the max size of filler to fit small packages
Reduced mold stain
Minimization of void problem
Reduces thermal strees by spplication of silicone modifier
High adherion
Low cost
Enhanced moldability and workability
Pass qualified for Pb-Free process(260℃)