Henkel Huawei Electronics Co.,Ltd

Products

- Recommendation of EMCMaterials for Discrete

	For Diode & Bridge
	For Transistor

- For SMA Type Package

For Full Pack Type Package

- Recommendation EMC Materials for IC

- Recommendation EMC Materials for SMD

- Green Molding Compound

Add:	Songtiao Hi-Tech Indestry Development Zone, Lianyungang,Jiangsu Province,China
Tel:	86-518-85153822
Fax:	86-518-85153801
P.C:	222006

Products Shows

Recommendation of EMCMaterials for Discrete

For Transistor
(TO-92/TO-220/TO-251/252/TO-3P)

Main Composition

	KL-1000-3/3L/3H	KL-1000-3AF/3AP	KL-1000-3NP	KL-2500-1 KL-1000-20	KL-2500-1K	KL-4500-1/1N
Epoxy	OCN	OCN	OCN	OCN	OCN+DCPD	OCN+DCPD
Hardener	PN	PN	PN	PN	PN+Xylok	PN+Xylok
Filler Content WT%	7476	7376	7376	7275	7378	7680
Fill Type	Crystal	Crystal+Fused	Crystal	Crystal+Fused	Crystal+Fused	Fused+Spherical
Additive		Strees-Releasing Agent		Strees-Releasing Agent	Strees-Releasing Agent	Strees-Releasing Agent
Package Application	TO92,126, 220	TO92,220,251, 252,3P	TO92,126, 220	TO220,3P	TO220,251, 252,3P	TO220,251, 252,3P

Main Technical Paramter

Item	Unit	KL-1000-FF	KL-1000-FX	KL-1000-3	KL-1000-3L	KL-1000-3H	KL-1000-3NP	KL-1000-5
Spiral Flow	cm	72	76	82	88	76	76	80
Gel Time	s	16	18	21	24	22	21	20
CTE-1	1/(ppm)	26	26	26	26	25	26	25
CTE-2	1/(ppm)	72	73	72	72	70	72	72
Tg	℃	164	164	162	165	170	180	162
Flexural Strength	Kdf/mm²	14	14	14	14	14	14	14
Flexural Modulus	Kdf/mm²	1440	1450	1450	1500	1600	1600	1600

Main Technical Paramter

Item	Unit	KL-1000-3AP	KL-1000-3AP	KL-1000-20	KL-2500-1	KL-2500-1K	KL-4500-1	KL-4500-1N
Spiral Flow	cm	70	80	80	82	94	86	90
Gel Time	s	16	20	25	24	22	21	20
CTE-1	1/(ppm)	24	24	21	20	20	16	15
CTE-2	1/(ppm)	70	70	68	68	67	62	60
Tg	℃	160	160	160	160	155	155	155
Flexural Strength	Kdf/mm²	14	14	14	13	13	13	13
Flexural Modulus	Kdf/mm²	1440	1450	1450	1500	1550	1550	1550

For TR PKG

Summary For Discretes Package of Huawei's Products

Characteristics
Based on crystal and fused silica
Low cost
Fast cure
Reduced mold stain
Minimization of void problem
Enhanced thermal conductivity
High moldability, workability adn reliability